Method to make a weight compensating/tuning layer on a substrate

ABSTRACT

Embodiments of the present invention form a weight-compensating/tuning layer on a structure (e.g., a silicon wafer with one or more layers of material (e.g., films)) having variations in its surface topology. The variations in surface topology take the form of thick and thin regions of materials. The weight-compensating/tuning layer includes narrow and wide regions corresponding to the thick and thin regions, respectively.

BACKGROUND

1. Field

Embodiments of the present invention relate to integrated circuits and,in particular, to integrated circuit fabrication processes.

2. Discussion of Related Art

In general, the basic process used in fabricating integrated circuitsincludes a material deposition stage, a patterning stage, a materialremoval stage, a doping stage, and a heating stage. The particularstages used depend on the type of devices to be included on theintegrated circuit.

In the deposition stage, many thin layers of material (e.g., films),each with particular properties, are deposited on a silicon wafer usingknown techniques, such as chemical vapor deposition (CVD). Due tovariations in wafer processing tools and/or techniques, sometimes thewafer may have variations in its surface topology. When a layer ofmaterial is then deposited on the wafer surface, the deposited layer mayconform to the surface topology of the wafer. The result tends to beuneven distribution of material.

Thickness variations can be particularly troublesome if fabricatedcomponents are to be used as frequency-selective devices commonly foundin communication systems such as cellular telephone systems that areintended to resonate at a particular frequency. This is because theweight distribution of material on the wafer determines the resonancefrequency. The resonance frequency determines the channel of operation.When the weight distribution cannot be controlled, the resonancefrequency cannot be controlled and thus the operating channel cannot becontrolled.

Traditional solutions to thickness variations include adding a chemicalmechanical planarization/polishing (CMP) stage to the fabricationprocess. CMP is a process technology used to planarize (i.e., make flat)one or more layers deposited on a wafer. In a typical CMP process thewafer is rotated and is polished (or planarized) using chemical slurry.This solution is adequate in many instances, but has limitations. Forexample; CMP is not selective enough and may thin an already thin areaon the layer of material while attempting to thin a thicker area.Additionally, using CMP to planarize a layer of material adds an extrastage to the fabrication process.

Another solution involves measuring the resonance frequency of thedevices and discarding defective components. This post situ or after thefact solution can be quite expensive, however. For example, thecomponents must are already be fabricated before determining whetherthey are suitable for use in a particular application.

Other solutions include laser correction, which also is a post situ orpost fabrication solution. As a result, it can be expensive and timeconsuming as well.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference numbers generally indicate identical,functionally similar, and/or structurally equivalent elements. Thedrawing in which an element first appears is indicated by the leftmostdigit(s) in the reference number, in which:

FIG. 1 is a flowchart illustrating a process for fabricating asemiconductor device according to an embodiment of the presentinvention;

FIG. 2 is a cross-section view of a structure fabricated according to anembodiment of the present invention;

FIG. 3 is a flowchart illustrating a process for fabricating asemiconductor device according to an alternative embodiment of thepresent invention;

FIG. 4 is a cross-section view of a structure fabricated according to analternative embodiment of the present invention; and

FIG. 5 is a high-level block diagram of a cellular communication systemaccording to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

FIG. 1 is a flowchart illustrating a process 100 for fabricating one ormore structures according to an embodiment of the present invention.FIG. 2 is a cross-section view of stages of fabrication of asemiconductor structure 200 using the process 100 according to anembodiment of the present invention. A machine-accessible medium withmachine-readable instructions thereon may be used to cause a machine toperform the process 100. Of course, the process 100 is only an exampleprocess and other processes may be used to implement embodiments of thepresent invention.

The operations of the process 100 are described as multiple discreteblocks performed in turn in a manner that is most helpful inunderstanding embodiments of the invention. However, the order in whichthey are described should not be construed to imply that theseoperations are necessarily order dependent or that the operations beperformed in the order in which the blocks are presented.

In a block 102, a layer of material 202 is formed on a wafer or asubstrate 204. The layer 202 may have variations in its surface topologycomprising thick 206 and thin 208 regions corresponding to wafer 204thick 210 and thin 212 regions caused by variations in the surfacetopology of the wafer 204.

In one embodiment, the layer 202 may be deposited using a known chemicalvapor deposition (CVD) technique such as rapid thermal chemical vapordeposition (RTCVD) or reduced pressure chemical vapor deposition(RPCVD). Alternatively, the layer 202 may be deposited using knownsputtering techniques.

In a block 104, narrow and wide regions are formed in the layer 204 thatcompensate for variations in the surface topology of the wafer 204. Thenarrow and wide regions in the layer 202 correspond to the thick andthin regions 210 and 212, respectively. The narrow and wide regions inthe layer 202 may compensate for uneven weight distribution caused byvariations in the surface topology of the wafer 204. Alternatively, theresulting layer 202 may provide controlled tuning (e.g., frequencytuning, wavelength tuning, resistivity tuning, etc.) despite variationsin the surface topology of the wafer 204.

The example narrow and wide regions of the layer 202 may be formed asfollows using photolithography and a photosensitive polymer(photoresist). For example, a layer of photoresist 220 may be disposedon the layer 202. The photoresist 220 may be exposed to light 222through a mask 224. The mask 224 may have an existing pattern to whichnear-resolution marks have been added. The near-resolution marks may beused to define narrow and wide regions of the layer 202 to correspond tothick and thin regions 210 and 212 of the wafer 204.

Techniques for adding near-resolution marks to an existing mask patternare known but not currently applied in this manner (i.e., to define thenarrow and wide regions that correspond to thick and thin regions of alayer of material on a wafer or substrate). Typically, near-resolutionmarks are used to produce very small structures. Thus, it iscounterintuitive to use near-resolution marks to modulate such largeareas according to embodiments of the present invention.

The exposed photoresist 220 may be developed and removed to reveal thelocation of areas defined by the near-resolution marks as well as theexisting mask pattern. Areas of the layer 202 are removed (e.g., trimmedusing known etching techniques) to leave narrow 228 and wide 230 regionscorresponding to thick and thin regions 210 and 212, respectively. Thus,the wafer 204 surface topology variations determine the size of thenarrow regions 228 and the wide regions 230. The remaining photoresist220 may be removed from the layer 202.

The example thick and thin regions 210 and 212 of the wafer 204 may becharacterized using a zone-compensation technique. This embodiment maybe implemented when there is systematic process non-uniformity acrosswafers 204 being fabricated.

In one embodiment of the present invention, in-line thickness metrologymay be used to characterize the thick regions 210 of the wafer 204 asone zone and the thin regions 212 as a second zone. Suitable in-linethickness metrology techniques are known and will not be describedfurther herein.

In another embodiment, frequency yield maps may be used to characterizethe thick regions 210 of the wafer 204 as one zone and the thin regions212 as a second zone. Suitable frequency yield mapping techniques areknown and will not be described further herein.

In still another embodiment, the example thick and thin regions 210 and212 may be characterized using a known ellipsometric mapped-compensationtechnique. Suitable ellipsometric mapping techniques are known and willnot be described further herein.

In still another embodiment, the example thick and thin regions 210 and212 may be characterized using a known laser mapped-compensationtechnique. Suitable laser mapping techniques are known and will not bedescribed further herein.

In still another embodiment, the example thick and thin regions 210 and212 may be characterized using a known capacitance mapped-compensationtechnique. Suitable capacitance mapping techniques are known and willnot be described further herein.

Ellipsometric mapping, capacitance mapping, laser mapping, or othersuitable mapping technique can be accomplished using in situ mapping ofthe thick and thin regions 210 and 212 on individual wafers 204.Alternatively, ellipsometric mapping, capacitance mapping, lasermapping, or other suitable mapping technique can be accomplished usingex situ mapping of the thick and thin regions 210 and 212 on individualwafers 204. These embodiments may be implemented when there is nosystematic process non-uniformity across wafers 204.

The wafer 204 may be a silicon (Si) wafer. Alternatively, the wafer 204may be a germanium (Ge) wafer or a gallium arsenide (GaAs) wafer. Inembodiments in which the wafer 204 may be a silicon (Si) wafer, agermanium (Ge) wafer, or a gallium arsenide (GaAs) wafer, the layer 202may be silicon (Si), germanium (Ge), or gallium arsenide (GaAs),respectively. Of course, other materials may be used and after readingthe description herein a person of ordinary skill in the relevant artwould readily recognize how to implement the layer 202 using variousother materials (e.g., metal or metallic alloy, a ceramic, an organiccompound, or other suitable material).

The structure 200 may be a micro-electrical-mechanical system (MEMS)such as that used in electronic devices, medical devices, communicationdevices, automobiles, military defense systems, etc. For example, thestructure 200 may be used as pressure sensors (e.g. blood pressure,fuel, air, etc), radio frequency (RF) components (e.g., filters,resonators, switches, etc.), airbag sensor, earthquake sensors, aircraftcontrol, etc.

FIG. 3 is a flowchart illustrating a process 300 for fabricating one ormore structures according to an embodiment of the present invention.FIG. 4 is a cross-section view of stages of fabrication of asemiconductor structure 400 using the process 300 according to anembodiment of the present invention. A machine-accessible medium withmachine-readable instructions thereon may be used to cause a machine toperform the process 300. Of course, the process 300 is only an exampleprocess and other processes may be used to implement embodiments of thepresent invention.

The operations of the process 300 are described as multiple discreteblocks performed in turn in a manner that is most helpful inunderstanding embodiments of the invention. However, the order in whichthey are described should not be construed to imply that theseoperations are necessarily order dependent or that the operations beperformed in the order in which the blocks are presented.

In a block 302, a layer of material 402 is formed on a wafer 404. Thelayer 402 may have variations in its surface topology comprising thick406 and thin 408 regions corresponding to wafer 204 thick 410 and thin412 regions caused by variations in the surface topology of the wafer404.

In a block 304, a sacrificial layer 406 of material is formed on layer402. The sacrificial layer 406 may have thick 414 and thin 416 regionscorresponding to thick and thin regions 410 and 412 of the wafer 404and/or thick and thin regions 406 and 408 of the layer 402.

In a block 306, narrow and wide regions are formed in the sacrificiallayer 406. The narrow and wide regions in the layer 402 correspond tothe thick and thin regions 410 and 412, respectively. The narrow andwide regions in the layer 406 may compensate for uneven weightdistribution caused by variations in the surface topology of the wafer404. Alternatively, the resulting layer 406 may provide controlledtuning (e.g., frequency tuning, wavelength tuning, resistivity tuning,etc.) despite variations in the surface topology of the wafer 404.

In embodiments of the present invention, the narrow and wide regions ofthe sacrificial layer 406 are formed as follows using electron beam,ultraviolet (UV) light, optical beam, or x-ray direct write of anear-resolution pattern on photoresist. For example, a layer ofphotoresist 420 may be disposed on the sacrificial layer 406. Anelectron beam, UV light, optical beam, or x-rays may be directed at thephotoresist 420 (e.g., scanned) to draw a near-resolution pattern in thephotoresist 420. The near-resolution pattern may define narrow and wideregions of the sacrificial layer 406 to correspond to thick and thinregions 410 and 412 of the wafer 404.

The exposed photoresist 420 is developed and removed to reveal thelocation of areas defined by the near-resolution pattern. Exposed areasof the sacrificial layer 406 are removed (e.g., trimmed using knownetching techniques) to leave narrow 428 and wide 430 regionscorresponding to thick and thin regions 410 and 412, respectively. In analternative embodiment, exposed areas of the sacrificial layer 406 maybe removed using planarization. For example, exposed areas of thesacrificial layer 406 may be removed using CMP techniques

The remaining photoresist 420 is removed from the sacrificial layer 406.In one embodiment, the photoresist 420 may be a non-conformingphotoresist (i.e., non-polymer or dry photoresist) that is sputterdeposited on the sacrificial layer 406. The photoresist 420 is exposedthermally and the near-resolution inorganic pattern remains on thesacrificial layer 406. In this embodiment, the photoresist 420 may beremoved using known techniques (e.g., plasma cleaning, ion milling,etc.).

In one embodiment, example thick and thin regions 410 and 412 of thewafer 404 may be determined and the narrow and wide regions the narrowand wide regions 428 and 430 of the layer 406 subsequently formed usinga zone-compensation technique similar to that described with respect toFIGS. 1 and 4 above.

In zones having the thick regions 410, the depth of focus of the lightsource and thus the spatial range of the light may be different than thedepth of focus and the spatial range in the zones in the thin regions412 (e.g., in the shape of the near-resolution pattern). Thus when thephotoresist on the layer 404 is exposed and developed, the areas of thelayer 404 can be removed leave the narrow regions 428 in the first zoneand the wide regions 430 in the second zone.

Alternatively, the zones having the thick regions 410 may receivedifferent imaging compensation (e.g., dose, depth of focus, etc.) thanthe zones having the thinner regions 412.

Example thick and thin regions 410 and 412 of the wafer 404 or the layer402 may be characterized using a zone-compensation technique (e.g.,in-line thickness metrology, frequency yield maps, ellipsometricmapping, laser mapping, capacitance mapping, etc.) similar to thatdescribed with respect to FIGS. 1 and 4 above. After reading thedescription herein, a person of ordinary skill will readily recognizehow to implement the mapped-compensation technique to form the narrowand wide regions 428 and 430.

The sacrificial layer 406 may be silicon (Si), germanium (Ge), galliumarsenide (GaAs), or other suitable material. After reading thedescription herein a person of ordinary skill in the relevant art wouldreadily recognize how to implement the sacrificial layer 406 usingvarious other materials (e.g., metal or metallic alloy, a ceramic, anorganic compound, or other suitable material).

FIG. 5 is a high-level block diagram of a cellular communication system500 according to an embodiment of the present invention. The system 500may transmit a wireless signal (e.g., radio frequency (RF) signal) forreception by another cellular communication system (not shown).

The example system 500 includes a transceiver 502 coupled to a memory504, an antenna 506, and a semiconductor structure 508 fabricatedaccording to embodiments of the present invention.

In one embodiment, the transceiver 502 may be a Global System for MobileCommunications (GSM) transceiver. Circuitry for implementing GSMtransceivers is well known. In an alternative embodiment, thetransceiver 502 may be a Personal Communication Service (PCS)transceiver. Circuitry for implementing PCS transceivers is well known.

The memory 504 may be a flash memory. Flash memories are well known.Alternatively, the memory may be a random access memory (RAM). SuitableRAM is well known.

The antenna 506 may be a dipole antenna. Dipole antennas are well known.

In one embodiment, the example structure 508 selects the transmissionfrequency of the wireless signal.

Although embodiments of the present invention have been described withrespect to depositing a layer of material on a wafer surface,embodiments are not so limited. For example, the layer of materialdescribed herein or the sacrificial layer of material described hereinmay be deposited on multiple (i.e., two or more) layer stack of filmsdisposed on a wafer. In a typical multiple layer stack, the layers mayinclude silicon nitride (SiN), aluminum (Al), silicate (SiO₂), etc.

Embodiments of the present invention may be implemented using hardware,software, or a combination thereof. In implementations using software,the software may be stored on a machine-accessible medium.

A machine-accessible medium includes any mechanism that provides (i.e.,stores and/or transmits) information in a form accessible by a machine(e.g., a computer, network device, personal digital assistant,manufacturing tool, any device with a set of one or more processors,etc.). For example, a machine-accessible medium includes recordable andnon-recordable media (e.g., read only memory (ROM), random access memory(RAM), magnetic disk storage media, optical storage media, flash memorydevices, etc.), as well as electrical, optical, acoustic, or other formof propagated signals (e.g., carrier waves, infrared signals, digitalsignals, etc.).

The above description of illustrated embodiments of the invention is notintended to be exhaustive or to limit embodiments of the invention tothe precise forms disclosed. While specific embodiments of, and examplesfor, the invention are described herein for illustrative purposes,various equivalent modifications are possible within the scope ofembodiments of the invention, as those skilled in the relevant art willrecognize. These modifications can be made to the embodiments of theinvention in light of the above detailed description.

In the above description, numerous specific details, such as particularprocesses, materials, devices, and so forth, are presented to provide athorough understanding of embodiments of the invention. One skilled inthe relevant art will recognize, however, that the embodiments of thepresent invention can be practiced without one or more of the specificdetails, or with other methods, components, etc. In other instances,well-known structures or operations are not shown or described in detailto avoid obscuring the understanding of this description.

Some parts of this description have been presented using terms such as,silicon, germanium, deposition, substrate, and so forth. These terms arecommonly employed by those skilled in the art to convey the substance oftheir work to others skilled in the art.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, process, block,or characteristic described in connection with an embodiment is includedin at least one embodiment of the present invention. Thus, theappearance of the phrases “in one embodiment” or “in an embodiment” invarious places throughout this specification does not necessarily meanthat the phrases all refer to the same embodiment. The particularfeatures, structures, or characteristics may be combined in any suitablemanner in one or more embodiments.

The terms used in the following claims should not be construed to limitembodiments of the invention to the specific embodiments disclosed inthe specification and the claims. Rather, the scope of embodiments ofthe invention is to be determined entirely by the following claims,which are to be construed in accordance with established doctrines ofclaim interpretation.

1. A method, comprising: forming a layer of material on a silicon wafer,the silicon wafer having variations in surface topology comprising atleast one thick region and at least one thin region, the layer ofmaterial having variations in surface topology comprising at least onethick regions and at least one thin region corresponding to the thickregions and the thin regions of the wafer, respectively; and forming atleast one narrow region and at least one wide region in the layer ofmaterial, the narrow regions and the wide regions corresponding to thethick regions and the thin regions of the wafer, respectively.
 2. Themethod of claim 1, further comprising: exposing photoresist disposed onthe layer of material to light through a mask having a pattern to whichnear-resolution marks have been added; and removing portions of thelayer of material to leave the narrow regions and the wide regions. 3.The method of claim 1, further comprising: characterizing the thickregions of the wafer as first zones; characterizing the thin regions ofthe wafer as second zones; and forming the narrow regions in the firstzones and the wide regions in the second zones.
 4. The method of claim3, further comprising: setting first imaging compensation for the firstzones and second imaging compensation for the second zones; and removingareas of the layer of material to leave the narrow regions in the firstzones and the wide regions in the second zones.
 5. The method of claim1, further comprising mapping the surface topology of the wafer todetermine the thick regions and the thin regions of the wafer.
 6. Themethod of claim 5, further comprising ellipsometric mapping, lasermapping, or capacitance mapping of the surface topology of the wafer todetermine the thick regions and the thin regions of the wafer.
 7. Anarticle of manufacture, comprising: a machine-accessible mediumincluding data that, when accessed by a machine, cause the machine toperform the operations comprising: forming a layer of material on asilicon wafer, the silicon wafer having variations in surface topologycomprising at least one thick region and at least one thin region, thelayer of material having variations in surface topology comprising atleast one thick regions and at least one thin region corresponding tothe thick regions and the thin regions of the wafer, respectively; andforming at least one narrow region and at least one wide region in thelayer of material, the narrow regions and the wide regions correspondingto the thick regions and the thin regions of the wafer, respectively. 8.The article of manufacture of claim 7, wherein the machine-accessiblemedium further includes data that cause the machine to performoperations comprising: exposing photoresist disposed on the layer ofmaterial to light through a mask having a pattern to whichnear-resolution marks have been added; and removing portions of thelayer of material to leave the narrow regions and the wide regions. 9.The article of manufacture of claim 7, wherein the machine-accessiblemedium further includes data that cause the machine to performoperations comprising: characterizing the thick regions of the wafer asfirst zones; characterizing the thin regions of the wafer as secondzones; and forming the narrow regions in the first zones and the wideregions in the second zones.
 10. The article of manufacture of claim 9,wherein the machine-accessible medium further includes data that causethe machine to perform operations comprising: setting first imagingcompensation for the first zones and second imaging compensation for thesecond zones; and removing areas of the layer of material to leave thenarrow regions in the first zones and the wide regions in the secondzones.
 11. The article of manufacture of claim 8, wherein themachine-accessible medium further includes data that cause the machineto perform operations comprising mapping the surface topology of thewafer to determine the thick regions and the thin regions of the wafer.12. A method, comprising: forming a first layer of material on a siliconwafer, the silicon wafer having variations in surface topologycomprising thick and thin regions, the layer of material havingvariations in surface topology comprising thick and thin regionscorresponding to the thick and thin regions of the wafer, respectively;and forming a sacrificial layer of material on the first layer, thesacrificial layer of material having variations in surface topologycomprising thick and thin regions corresponding to the thick and thinregions of the first layer, respectively; and forming narrow and wideregions in the sacrificial layer of material, the narrow and wideregions corresponding to the thick and thin regions of the wafer,respectively, using direct write of a near-resolution pattern onphotoresist disposed on the sacrificial layer.
 13. The method of claim12, further comprising direct writing the near-resolution pattern usingat least one of an electron beam, ultraviolet (UV) light, x-rays, or anoptical beam.
 14. The method of claim 12, further comprising forming thenarrow and wide regions in the sacrificial layer of material usingdirect write of a near-resolution pattern on a photosensitive polymerdisposed on the sacrificial layer.
 15. The method of claim 14, furthercomprising forming the narrow and wide regions in the sacrificial layerof material using direct write of a near-resolution pattern on anon-polymer photoresist disposed on the sacrificial layer.
 16. Themethod of claim 12, further comprising: characterizing the thick regionsof the wafer as first zones; characterizing the thin regions of thewafer as second zones; and forming the narrow regions in the first zonesand the wide regions in the second zones.
 17. The method of claim 16,further comprising: setting first image compensation for the first zonesand second image compensation for the second zones; and removing areasof the layer of material to leave the narrow regions in the first zonesand the wide regions in the second zones.
 18. The method of claim 12,further comprising mapping the surface topology of the wafer todetermine the thick regions and the thin regions of the wafer.
 19. Anarticle of manufacture, comprising: a machine-accessible mediumincluding data that, when accessed by a machine, cause the machine toperform the operations comprising: forming a first layer of material ona silicon wafer having variations in surface topology comprising thickand thin regions in its surface topology, the first layer havingvariations in surface topology comprising thick and thin regionscorresponding to the thick and thin regions of the wafer, respectively;and forming a sacrificial layer of material on the first layer, thesacrificial layer having variations in surface topology comprising thickand thin regions corresponding to the thick and thin regions of thefirst layer, respectively; and forming narrow and wide regions in thesacrificial layer using direct write of a near-resolution pattern onphotoresist disposed on the sacrificial layer, the narrow and wideregions corresponding to the thick and thin regions of the wafer,respectively.
 20. The article of manufacture of claim 19, wherein themachine-accessible medium further includes data that cause the machineto perform operations comprising direct writing the near-resolutionpattern using at least one of an electron beam, ultraviolet (UV) light,x-rays, or an optical beam.
 21. The article of manufacture of claim 19,wherein the machine-accessible medium further includes data that causethe machine to perform operations comprising forming the narrow and wideregions in the sacrificial layer of material using direct write of anear-resolution pattern on a photosensitive polymer disposed on thesacrificial layer.
 22. The article of manufacture of claim 19, whereinthe machine-accessible medium further includes data that cause themachine to perform operations comprising forming the narrow and wideregions in the sacrificial layer of material using direct write of anear-resolution pattern on a non-polymer photoresist disposed on thesacrificial layer.
 23. A system, comprising: a transceiver to transmit awireless signal; a semiconductor structure coupled to the transceiver toselect a frequency of the wireless signal, the semiconductor structurehaving: a silicon wafer, the silicon wafer having variations in surfacetopology forming at least one thick region and at least one thin region;and a layer of material formed on the silicon wafer, the layer ofmaterial having at least one narrow region and at least one wide regioncorresponding to the thick regions and the thin regions of the wafer,respectively; a memory coupled to the transceiver.
 24. The system ofclaim 23, wherein the transceiver is a Global System for MobileCommunication (GSM) transceiver.
 25. The system of claim 23, wherein thetransceiver is a PCS transceiver.